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C11000 PCB Copper Foil

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C11000 PCB Copper Foil

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Brand Name : OEM

Place of Origin : China

Certification : ISO / SGS / RoHS

Supply Ability : 550T Per Month

Packaging Details : Exporting Wooden Case

MOQ : 50kg

Price : Negotiable

Delivery Time : 10 - 15 Days

Payment Terms : L/C, T/T

Application : relay parts

Thickness : 0.035- 2.5mm

Width : 7--610mm

Material : Red Copper

Grade : Pure Copper

Cu (Min) : 99.90%

Alloy Or Not : Non-alloy

Name : C11000 red copper strip

Shape : customised

Color : Red

Type : Flat

Length : Customer's Demands

Electric 20 CConductivity : C11000 >97%

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 C11000 PCB Copper Foil
 

GB/TDINENASTM
TU2E Cu58Cu ETPC11000

 
 
Material introduction:C11000(Cu ETP)
 
         Cu ETP  is  an  electrolytically  refined oxygen-containing copper.  It has good electrical conductivity but compared with other high conductivity copper due to the high residua oxygen content of the alloy  it is  not suitable  for  processing (annealing welding etc.) and use in high temperature   ( temperature  greater  than  370 ° C )  reducing  gas.  Because  it  is  prone  to hydrogen  embrittlement  when the material  is heated to 600 ° C or  higher the oxygen inside the material  will form  water vapor  with the hydrogen in the air causing the  internal structure of the material to be brittle and cremated so hydrogen embrittlement occurs.
 
Material Features:
 
1. Cu copper content is greater than 99.9% oxygen content 5-40 PPM
2. Compared with oxygen-free copper C10200 OFC the processing cost is lower.
3. Not suitable for use at temperatures above 370 ° C prone to hydrogen embrittlement
4. Widely used in electronic parts of electrical components, electrical products
 
Physical properties
 

Density(g/cm3)

           8.9

Electrical conductivity{IACS%(20℃)}

           100

Modulus of elasticity(KN/mm2)

         127

 Thermal conductivity{W/(m*K)}

           394

 Coefficient of thermal expansion (10-6/℃ 20/℃~100/℃)

         17.7 

 
 Mechanical Properties 
 

Temper

Tensile Strength

Elongation A50

Hardness

     (Rm,Mpa)

                  %

HV

0

           195min                 35min          60max

1/4H

           215-255                  25min          55-100

1/2H

           255-315                  15min          75-120 

H

           290min                  5min          80 

 
Chemical composition   

Cu≥99.90

O

0.005-0.040

 
Application
 
Conductive parts, exchanger coils, heat exchangers
 
 
 C11000 PCB Copper Foil
 



























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